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Hotspot Thermal Management with Flow Boiling of Refrigerant in Ultrasmall Microgaps

Journal of Electronic Packaging, ISSN: 1528-9044, Vol: 139, Issue: 1
2017
  • 21
    Citations
  • 0
    Usage
  • 22
    Captures
  • 0
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

  • Citations
    21
    • Citation Indexes
      21
  • Captures
    22

Article Description

As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two microgap heat sink configurations was investigated as a solution for hotspot thermal management: a bare microgap and inline micro-pin fin populated microgap, both with 10 μm gap height, were tested in terms of their ability to dissipate heat fluxes approaching 5 kW/cm at the heat source. Additional parameters investigated include mass fluxes up to 3000 kg/m s at inlet pressures up to 1.5 MPa and exit qualities approaching unity. The microgap testbeds investigated consist of a silicon layer which is heated from the bottom using resistive heaters and capped with glass to enable visual observation of two-phase flow regimes. Wall temperature, device thermal resistance, and pressure drop results are presented and mapped to the dominant flow regimes that were observed in the microgap.

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