Hotspot Thermal Management with Flow Boiling of Refrigerant in Ultrasmall Microgaps
Journal of Electronic Packaging, ISSN: 1528-9044, Vol: 139, Issue: 1
2017
- 21Citations
- 22Captures
Metric Options: Counts1 Year3 YearSelecting the 1-year or 3-year option will change the metrics count to percentiles, illustrating how an article or review compares to other articles or reviews within the selected time period in the same journal. Selecting the 1-year option compares the metrics against other articles/reviews that were also published in the same calendar year. Selecting the 3-year option compares the metrics against other articles/reviews that were also published in the same calendar year plus the two years prior.
Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two microgap heat sink configurations was investigated as a solution for hotspot thermal management: a bare microgap and inline micro-pin fin populated microgap, both with 10 μm gap height, were tested in terms of their ability to dissipate heat fluxes approaching 5 kW/cm at the heat source. Additional parameters investigated include mass fluxes up to 3000 kg/m s at inlet pressures up to 1.5 MPa and exit qualities approaching unity. The microgap testbeds investigated consist of a silicon layer which is heated from the bottom using resistive heaters and capped with glass to enable visual observation of two-phase flow regimes. Wall temperature, device thermal resistance, and pressure drop results are presented and mapped to the dominant flow regimes that were observed in the microgap.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85009112266&origin=inward; http://dx.doi.org/10.1115/1.4035387; https://asmedigitalcollection.asme.org/electronicpackaging/article/doi/10.1115/1.4035387/372635/Hotspot-Thermal-Management-With-Flow-Boiling-of; http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4035387/6141871/ep_139_01_011006.pdf; https://dx.doi.org/10.1115/1.4035387; https://asmedigitalcollection.asme.org/electronicpackaging/article-abstract/139/1/011006/372635/Hotspot-Thermal-Management-With-Flow-Boiling-of?redirectedFrom=fulltext
ASME International
Provide Feedback
Have ideas for a new metric? Would you like to see something else here?Let us know