A forward time stepping heat conduction model for spot melt additive manufacturing
Journal of Heat Transfer, ISSN: 1528-8943, Vol: 141, Issue: 11
2019
- 6Citations
- 8Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
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Article Description
Solidification dynamics are crucial for determining microstructure development in additively manufactured parts. Multiphysics models based on finite element or finite volume methods may help gain insight for complicated phenomena such as fluid flow, keyholing, and porosity but are too computationally expensive to use for simulating actual builds. Recent analytic and semi-analytic solutions for moving heat sources in a semi-infinite three-dimensional space provide a way to accurately estimate the solidification conditions for entire builds. The downside to these methods is that, unlike finite element or finite volume methods, they cannot use the temperature distribution of the previous timesteps to march the solution forward in time. This paper provides the mathematical formulation and implementation of a forward time stepping (FTS) approach to an existing semi-analytic solution. The speed and accuracy of the two methods are then compared for various scan patterns. The result is that, for spot melts, the forward time-stepping model provides improvements in both speed and accuracy. This is especially true for longer simulations, where the simulation can be orders of magnitude faster. The longest simulation analyzed in this paper was roughly 30* faster when using the forward time-stepping model versus the straightforward implementation of the semi-analytic solution.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85084821801&origin=inward; http://dx.doi.org/10.1115/1.4044595; https://asmedigitalcollection.asme.org/heattransfer/article/doi/10.1115/1.4044595/975440/A-Forward-Time-Stepping-Heat-Conduction-Model-for; http://asmedigitalcollection.asme.org/heattransfer/article-pdf/doi/10.1115/1.4044595/5874391/ht_141_11_112301.pdf; http://asmedigitalcollection.asme.org/heattransfer/article-pdf/doi/10.1115/1.4044595/5429489/ht-19-1050.pdf; https://dx.doi.org/10.1115/1.4044595; https://asmedigitalcollection.asme.org/heattransfer/article-abstract/141/11/112301/975440/A-Forward-Time-Stepping-Heat-Conduction-Model-for?redirectedFrom=fulltext
ASME International
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