Quality properties of doughs and noodles using chayotextle (Sechiem edule) flours
Food Science and Technology (Brazil), ISSN: 1678-457X, Vol: 41, Issue: 1, Page: 158-166
2021
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Article Description
The quality and physicochemical properties of dough and noodles made from blends of chayotextle flour and wheat semolina were investigated. The results showed that the inclusion of chayotextle flour increased both the hardness and adhesiveness of the dough, and there was a 10% increase in cohesiveness and elasticity when using this particular flour. Regarding dough extensibility, no significant differences were found (p < 0.05) in the control, while the proximal chemical analysis on dough showed that T1 (16.28%) had a higher protein content compared to the control. These results indicate that the optimum mixture for the preparation of dough was obtained by using 10% chayotextle flour. It is concluded that incorporating appropriate amounts of this flour into wheat semolina during the production of dough maintains technological quality as well as texture and sensory perceptions.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85102764852&origin=inward; http://dx.doi.org/10.1590/fst.30219; http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0101-20612021000100158&tlng=en; http://www.scielo.br/pdf/cta/v41n1/0101-2061-cta-fst30219.pdf; http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0101-20612021000100158&lng=en&tlng=en; http://www.scielo.br/scielo.php?script=sci_abstract&pid=S0101-20612021000100158&lng=en&tlng=en; http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0101-20612021000100158; http://www.scielo.br/scielo.php?script=sci_abstract&pid=S0101-20612021000100158; http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0101-20612020005022222&lng=en&tlng=en; http://www.scielo.br/scielo.php?script=sci_abstract&pid=S0101-20612020005022222&lng=en&tlng=en; http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0101-20612020005022222; http://www.scielo.br/scielo.php?script=sci_abstract&pid=S0101-20612020005022222; https://dx.doi.org/10.1590/fst.30219; https://www.scielo.br/j/cta/a/VgpRb4Kkz7jbNbZG3gzXKHk/?lang=en
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