Multilayered Cu/NiFe Thin Films for Electromagnetic Interference Shielding at High Frequency
SSRN, ISSN: 1556-5068
2022
- 177Usage
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
Cu/NiFe multilayers with different structures were fabricated by electroplating for electromagnetic wave interference shielding in the high-frequency region. The electromagnetic wave interference shielding effectiveness of symmetric, asymmetric, and thickness-gradient multilayer films was evaluated to optimize these structures. The thickness of the NiFe layer acting as an interlayer between the Cu layers is an important factor. The five-layered thin film (S9) with a thickness gradient that continues to increase toward the lower layer shows an electromagnetic interference shielding effect of −74 dB in the wideband, even though the total thickness of the multilayer is 1 μm. Focused ion beam, scanning electron microscopy, vector network analysis, X-ray diffraction, 4-point probe, and inductively coupled plasma-optical emission spectroscopy were carried out to characterize the multilayered Cu/NiFe thin films.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85179540157&origin=inward; http://dx.doi.org/10.2139/ssrn.4064422; https://www.ssrn.com/abstract=4064422; https://dx.doi.org/10.2139/ssrn.4064422; https://papers.ssrn.com/sol3/papers.cfm?abstract_id=4064422; https://ssrn.com/abstract=4064422
Elsevier BV
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