PlumX Metrics
Embed PlumX Metrics

Multilayered Cu/NiFe Thin Films for Electromagnetic Interference Shielding at High Frequency

SSRN, ISSN: 1556-5068
2022
  • 0
    Citations
  • 177
    Usage
  • 0
    Captures
  • 0
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

  • Usage
    177
    • Abstract Views
      145
    • Downloads
      32

Article Description

Cu/NiFe multilayers with different structures were fabricated by electroplating for electromagnetic wave interference shielding in the high-frequency region. The electromagnetic wave interference shielding effectiveness of symmetric, asymmetric, and thickness-gradient multilayer films was evaluated to optimize these structures. The thickness of the NiFe layer acting as an interlayer between the Cu layers is an important factor. The five-layered thin film (S9) with a thickness gradient that continues to increase toward the lower layer shows an electromagnetic interference shielding effect of −74 dB in the wideband, even though the total thickness of the multilayer is 1 μm. Focused ion beam, scanning electron microscopy, vector network analysis, X-ray diffraction, 4-point probe, and inductively coupled plasma-optical emission spectroscopy were carried out to characterize the multilayered Cu/NiFe thin films.

Bibliographic Details

Hyun Jun Kwon; Jong-Hwan Park; Su-Jeong Suh

Elsevier BV

Multidisciplinary; Cu; NiFe; multilayers; electromagnetic interference; shielding effectiveness; high frequency

Provide Feedback

Have ideas for a new metric? Would you like to see something else here?Let us know