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Variable Layer Heights in Wire Arc Additive Manufacturing and WAAM Information Models

Machines, ISSN: 2075-1702, Vol: 12, Issue: 7
2024
  • 1
    Citations
  • 0
    Usage
  • 11
    Captures
  • 1
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

  • Citations
    1
  • Captures
    11
  • Mentions
    1
    • News Mentions
      1
      • News
        1

Most Recent News

Data on Mechanical Engineering and Machinery Discussed by Researchers at RWTH Aachen University (Variable Layer Heights in Wire Arc Additive Manufacturing and WAAM Information Models)

2024 AUG 12 (NewsRx) -- By a News Reporter-Staff News Editor at Engineering Daily News -- Fresh data on mechanical engineering and machinery are presented

Article Description

In Wire Arc Additive Manufacturing (WAAM), variable layer heights enable the non-parallel or non-planar slicing of parts. In researching variable layer heights, this paper documents printing strategies for a reference geometry whose key features are non-orthogonal growth and unsupported overhangs. The complexity of 3D printing with welding requires parameter optimization to control the deposition of molten material. Thus, 3D printing with welding requires the precise deposition of molten material. Currently, there is no standard solution for the customization of process parameters and intelligent collection of data from sensors. To address this gap in technology, this research develops an Internet of Things (IoT)-enabled, distributed communication protocol to control process parameters, synchronize commands, and integrate device data. To intelligently collect sensor information, this research creates a query-able database during pre-planning and production. This contributes to fundamental research in WAAM by documenting strategies for printing variable layer heights, the customization of control parameters, and the collection of data through a WAAM Information Model (WIM).

Bibliographic Details

Ethan Kerber; Heinrich Knitt; Jan Luca Fahrendholz-Heiermann; Emre Ergin; Sigrid Brell-Cokcan; Peter Dewald; Rahul Sharma; Uwe Reisgen

MDPI AG

Engineering; Computer Science; Mathematics

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