Characterization of cobalt films on X-ray lithographic micropillars
Advanced Materials Research, ISSN: 1022-6680, Vol: 335-336, Page: 1000-1003
2011
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Conference Paper Description
Arrays of SU-8 photoresist pillars (10 μm ×10 μmm ×50 μmm) on copper substrates were fabricated by X-ray lithography. The photoresist-coated substrates were irradiated by X-ray from a synchrotron source through patterned silver dots on a graphite mask. After the resist development, the chemically stable and mechanically hardened SU-8 pillars exhibited smooth vertical sidewalls and cross section with up to 10 % dimensional errors from the designated pattern. Cobalt of thickness ranging from 50 to 80 nm was then deposited on these patterned substrates by RF sputtering. These cobalt films on SU-8 pillars showed a lower in-plane magnetization than that of continuous cobalt films because of their smaller grain size. The measurement with out-of-plane magnetic field gave rise to a higher magnetization and this anisotropic behavior was observed only in cobalt-coated pillars. © (2011) Trans Tech Publications.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=80053391466&origin=inward; http://dx.doi.org/10.4028/www.scientific.net/amr.335-336.1000; https://www.scientific.net/AMR.335-336.1000; https://www.scientific.net/AMR.335-336.1000.pdf; http://www.scientific.net/AMR.335-336.1000; http://www.scientific.net/AMR.335-336.1000.pdf; https://dx.doi.org/10.4028/www.scientific.net/amr.335-336.1000
Trans Tech Publications, Ltd.
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