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Roughness and uniformity control during wet etching of molybdenum

Solid State Phenomena, ISSN: 1662-9779, Vol: 314 SSP, Page: 295-301
2021
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Conference Paper Description

Abstract. In this work the wet etching of molybdenum thin films was investigated for applications requiring controlled recess without roughening or pattern loading. First, continuous etching of Mo in alkaline and oxidative peroxide solutions was studied. Then, additives like glycine and diethylenetriamine were used and their effect on etch rate and roughness was assessed. Finally, we evaluated if the requirements for a stepwise etching approach for Mo recess using peroxide or ozonate water as the oxidizing step and ammonia as the oxide dissolution agent were met.

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