PlumX Metrics
Embed PlumX Metrics

Impact of metallurgical and mechanical properties of sintered silver joints on die-attach reliability of high-temperature power modules

Journal of Microelectronics and Electronic Packaging, ISSN: 1551-4897, Vol: 13, Issue: 3, Page: 121-127
2016
  • 8
    Citations
  • 0
    Usage
  • 5
    Captures
  • 0
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

Conference Paper Description

Sintered silver bonding processes are expected to offer bonding solutions with high heat endurance for power modules using wide bandgap semiconductors. This study reports the dieattach reliability of the bonding process under thermal cycling tests, focusing on the metallurgical and mechanical properties of sintered silver joints. A nanocrystalline (NC) structure with 150-nm-sized grains was observed in the as-sintered state, while a coarsened structure with microsized grains and pore coalescence was observed after annealing at 350°C for 1 h. In addition, the increase of bonding pressure reduced the number of coarse pores. Transmission electron microscope observations showed favorable crystalline structure along the grain boundaries. Tensile tests at room and high temperature revealed that the sintered silver materials showed the inherent mechanical properties of NC metals. Thermal cycling tests of die-attached specimens demonstrated the temperature dependence of crack resistance at constant amplitude. Furthermore, coalescence of pores and coarsening of grains reduced bonding reliability. It can be inferred from the results that NC structure and minute pore dispersion improves bonding reliability.

Bibliographic Details

Hiroaki Tatsumi; Sho Kumada; Hiroshi Yamaguchi; Yoshihiro Kashiba; Atsushi Fukuda

IMAPS - International Microelectronics Assembly and Packaging Society

Materials Science; Computer Science; Engineering

Provide Feedback

Have ideas for a new metric? Would you like to see something else here?Let us know